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Q二极管的反向漏电能抵消用电器上的漏电流吗？
AIt is depends on the design spec , the body diode inside the mosfet also has the leakaeg current so far.
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QIC集成能否取代分立式MOSFET？
Ait is depends on the function bcs the mosfet will get the heat , the heat will impact the IC performance. the switching performance is another concern.
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Q在散热问题上，请问你们是如何解决的？
Athe bigger pad size will help the heat dissipate.
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QPMPB11EN的详细指标在哪里
APMPB11EN provide the lower Rds(on) with around 11mOhm
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Q如何在节省pcb空间的同时确保散热？
Athe pad in bottum side will help the heat go through the pcb to get the higher power dissipation capability for this device.
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Q如何下载相关的技术资料？
Apls go thorugh below website. http://www.nxp.com
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Q这种超小型MOSFET封装主要用在哪些方面？
AIt is used in portable device application.
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Qdfn1010、dfn2020、dfn1006应用上有何区别？
ADFN2020 provide the higher power dissipation capability DFN1010 size is 1.0*1.0 DFN202 size is 2.0*2.0 DFN1006 size is 1.0*0.6
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Qdfn1010封装晶体管功率耗散、电压范围是多少？
Athe DFN1010 power dissipation capability is up to 1w
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Q产品都已经上市了吗？
Awhole the DFN2020 , DFN1010 and DFN1006 device alreday released in this market
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Q带引脚封装会全部被无引脚封装取代？
Ait depends on the design , for portable device , the DFN package is the trend in the future.
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Q在4层pcb电路板上时，散热性能与smd封装相比如何？
Athe more pad size will help to dissipate the heat , the more pcb layers would aslo help to dissipate the heat
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Q小信号MOSFET有无引脚封装吗？
Ayes , we provide the DFN1006 package for small signal switch application.
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Q封装尺寸还会向更小的方向发展吗？
Asince the end product "slim" and "light" design is the trend in the future , the compoenet is also become more and more smaller.
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QNXP的DNF产品较其他厂商产品有什么优势？
ANXP DFN package provide the solder side pad to get the higher solderability and easy checking the soldering quality.
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Q元器件应用的时候是否需要更多关注元器件的散热？
Athe thermal perfromacne is very important for such kind of device and design.
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Q恩智浦都有哪些产品？
ANXP standard product provide the transistor , diode , mosfet and ESD protection device.
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QNXP这种超小型MOSFET封装有哪些优势？
Aprovide the smaller package size but higher power dissipation capability.
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Q这种封装适用的温度范围是多少？
AThe Tj (max) is 150deC.
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Q还有哪些厂商做超小型的封装吗？这是一种趋势吗？
AThere are more and more vendors provide such package in this market , it is the design trend in the fututre.
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