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Q无引脚封装是否能代替带引脚的封装？
ADFN package could replace the normal package and higher power density
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Q产品最快交货周期多长?
AIt depend on defferent part number
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Q尺寸小了，电流是否也小了
Acompare with the normal package , the DFN package provide the smaller dimension but higher current capability.
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Q目前有nxp有多少款mosfet产品采用dfn1010封装？
Amore than 20 different types
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Q同等性能下，DFN封装的场效三极管会带来大约多少效率提升？
ADFN package provide the higher power density compare with the normal package. It means the DFN package provide the smaller deimension but better power dissipation.
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Q请问一下 可以直接根据电源的输入和输出选择合适的MOSFET吗？？？比如输入：85-265 输出12v 3.5A
ABase on the Vin , Vout and output current to come out the total power dissipation. You can base on the power dissipation to select the mosfet Rds(on) and power dissipation capability to get the right chioce.
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Q无引脚封装相比带引脚的有什么优势？
Asamller package with higher power density , reduce the PCB size , provide the lower height
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Q现在普遍应用的是无引脚的还是带引脚的？
ADFN package is popular in portable device design now.
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Q小信号三极管一般作为控制开关用,要让其饱和导通,它的基极电流一般取多少?
Ait is depends on the Hfe value
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Q无引脚会不会全面取代带引脚的？
AThe DFN package is the design trend for the slim type device , the DFN package is popular in this kind of design now and it will be the mainstream in the future.
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Q怎样降低导通损耗的？
AThe power loss include the conduction loss and switching loss. for load switch application , the conduction loss is the key factor. The lower Rds(on) helps to reduce the power dissipation.
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QDFN1010这种封装形式应用于哪些领域？
AThe DFN1010 package is suitable for mobile , slim type design application.
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Q开关电源的可靠性和性价比是不是也有了新要求？
Athe design trend is the smaller package with higher power density
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Qnxp小信号MOSFET是否易遭静电损毁？
Asome device provide the esd protection function , some device not.
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Q这种超小型封装只能应用于电源管理器件上吗？
AThe kind sof packages are suitable for both signal and power switch application.
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Q哪里有DFN封装的dxp封装库下载？
Apls refer to below website http://www.nxp.com
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Q焊接布局和PCB状态对功耗有什么影响？
AThe bigger pad size will help to dissipate the heat , the device could handle the hgiher power dissipation.
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Q是否适用于汽车仪表盘？
Asome devices are meet the auotmotive specification
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Q更多xtal尺寸纳入封装有什么好处？只是降低封装尺寸吗？
Athe more xtal in side the package will get the lower Rds(on) to reduce the power dissipation.
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Q无引脚封装为什么可以提高最大漏极电流能力？
ADFN package provide the bigger pad in bottum side , the heat could go through the PCB to disappear the heat , so the power dissipation capability is better than the normal package , the higher power dissipation capability will get the higher Id current.
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