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LFPAK 封装三极管及三极管在LED Driver应用介绍 2014-04-17 10:00:00
  • QNXP三极管应用在LED Driver上有什么优势?

    AHigh thermal power capability Stabilized output current adjustable up to 65mA when external resistor used 1:1 Replacement for Infineon BCR401U / BCR402U / BCR405U

  • QLFPAK相比QFN package有什么优势?价格上会不会更高?

    AQFN sawn or micro-lead pins are fully encapsulated and do not allow for as much movement – mainly associated to high power components due to temperature changes Cracks in the mould compound can lead to failure of the MOSFET LFPAK pins allow for thermal expansion due to temperature difference between the MOSFET & PCB and also mechanical strain due to PCB bending & flexing

  • Q最高工作温度是多少?

    ATj=150deC.

  • QLFPAK是NXP特有的吗?

    Ayes

  • Q高抗ESD有什么用?

    AIt will help the design more robust

  • QLFPAK56具体有多薄?

    A1mm ( typical )

  • QLFPAK56散热怎么样?

    A The heat go through the buttom side pad to pcb

  • Q恩智浦LFPAK封装采用的设计是怎么样的?

    AQFN sawn or micro-lead pins are fully encapsulated and do not allow for as much movement – mainly associated to high power components due to temperature changes Cracks in the mould compound can lead to failure of the MOSFET LFPAK pins allow for thermal expansion due to temperature difference between the MOSFET & PCB and also mechanical strain due to PCB bending & flexing

  • Q相比较DPAK,LFPAK能节省多少面积?

    A25% reduce compare with DPAK

  • QLFPAK有哪些封装方式?

    ALFPAK is usin g the clip bonding technology

  • QLFPAK56最高可以承受的温度是多少?

    ATj=175deC

  • QLFPAK56除了用于车载还可以用在其他领域吗?

    AMotor drive Loadswitch Linear regulators Back light units Gate Drive (IGBT, MOS)

  • QLFPAK将取代DPAK和SO-8封装?

    AYes , bcs of the good thermal performance with smaller dimension.

  • Q现在LFPAK是主流封装方式吗?

    AYES

  • Q能否与SO-8兼容?

    AYES

  • QLFPAK封装最薄能达到多少?

    ALFPAK5X6 hight is 1mm (typ)

  • QLFPAK封装最高能在多高的温度环境下?

    ATj=175deC

  • QLFPAK封装的三级管可以用在哪些领域?

    AMotor drive Loadswitch Linear regulators Back light units Gate Drive (IGBT, MOS)

  • Q怎样优化散热性能的?是从封装的顶部分散热量么?

    Ait dssipate the heat through the buttom side thermal pad

  • Q与传统的SO8封装在引脚位置和分布相同么?

    Ayes